Temperature rise in low-k ULSI interconnects

International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT

Volumn 1, Issue , 2004, Pages 524-527

  Zhou, Jia ^a   Ruan, Gang ^a   Xiao, Xia ^b   Huang, Yiping ^a   Lee, H D ^c  

^a FUDAN UNIVERSITY   (China)

^b TIANJIN UNIVERSITY   (China)

^c Chungnam National University   (South Korea)

Author keywords

50 node technology; Interconnect; Low k; Temperature analysis; ULSI

Indexed keywords

DIELECTRIC MATERIALS; ERROR ANALYSIS; HEAT TRANSFER; OPTICAL INTERCONNECTS; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY;

LOW K; NODE TECHNOLOGY; SCALING DOWN; TEMPERATURE ANALYSIS;

ULSI CIRCUITS;

EID: 21644435289     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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