-
1
-
-
85013874321
-
On-chip Communication Architectures
-
Morgan Kauffman/Elsevier, Apr
-
S. Pasricha, N. Dutt "On-chip Communication Architectures" Morgan Kauffman/Elsevier, Systems On Silicon Series, Apr 2008
-
(2008)
Systems On Silicon Series
-
-
Pasricha, S.1
Dutt, N.2
-
2
-
-
0038665264
-
Bottom-up approach for carbon nanotube interconnects
-
Apr
-
J. Li, et al., "Bottom-up approach for carbon nanotube interconnects," Appl. Phys. Lett., Vol. 82, Iss. 15, pp. 2491-2493, Apr. 2003.
-
(2003)
Appl. Phys. Lett
, vol.82
, Issue.ISS. 15
, pp. 2491-2493
-
-
Li, J.1
-
3
-
-
1642397073
-
Alteration of Cu Conductivity in the Size Effect Regime
-
Jan
-
S. M. Rossnagel, T. S. Kuan, "Alteration of Cu Conductivity in the Size Effect Regime," JVST, Vol. 22, Iss. 1, pp. 240-247, Jan. 2004.
-
(2004)
JVST
, vol.22
, Issue.ISS. 1
, pp. 240-247
-
-
Rossnagel, S.M.1
Kuan, T.S.2
-
4
-
-
51949093748
-
-
ITRS, International Technology Roadmap for Semiconductors
-
ITRS, International Technology Roadmap for Semiconductors, 2005.
-
(2005)
-
-
-
5
-
-
0003790413
-
-
Springer
-
M. S. Dresselhaus, et al, "Carbon nanotubes: synthesis, structure, properties, and applications", Springer, 2001.
-
(2001)
Carbon nanotubes: Synthesis, structure, properties, and applications
-
-
Dresselhaus, M.S.1
-
6
-
-
2342466950
-
Luttinger liquid theory at a model of the gigahertz electrical properties of carbon nanotubes
-
Sep
-
P. J. Burke, "Luttinger liquid theory at a model of the gigahertz electrical properties of carbon nanotubes," Trans. NANO, Vol. 1, Iss. 3, pp. 129-144, Sep. 2002.
-
(2002)
Trans. NANO
, vol.1
, Issue.ISS. 3
, pp. 129-144
-
-
Burke, P.J.1
-
7
-
-
21644462975
-
Carbon nanotubes for interconnect applications
-
Dec
-
F. Kreupl, et al., "Carbon nanotubes for interconnect applications," IEDM Tech. Dig., pp. 683-686, Dec. 2004.
-
(2004)
IEDM Tech. Dig
, pp. 683-686
-
-
Kreupl, F.1
-
8
-
-
33748630936
-
Performance Analysis of Carbon Nanotube Interconnects for VLSI Applications
-
N. Srivastava, K. Banerjee, "Performance Analysis of Carbon Nanotube Interconnects for VLSI Applications," Proc. ICCAD, pp. 383-390, 2005.
-
(2005)
Proc. ICCAD
, pp. 383-390
-
-
Srivastava, N.1
Banerjee, K.2
-
9
-
-
16244369436
-
A circuit model for carbon nanotube interconnects: Comparative study with Cu interconnects for scaled technologies
-
A. Raychowdhury, K. Roy, "A circuit model for carbon nanotube interconnects: comparative study with Cu interconnects for scaled technologies", Proc. ICCAD, pp. 237-240, 2004.
-
(2004)
Proc. ICCAD
, pp. 237-240
-
-
Raychowdhury, A.1
Roy, K.2
-
10
-
-
33846098642
-
Design and Performance Modeling for Single-Walled Carbon Nanotubes as Local, Semiglobal, and Global Interconnects in Gigascale Integrated Systems
-
Jan
-
A. Naeemi, J.D. Meindel, "Design and Performance Modeling for Single-Walled Carbon Nanotubes as Local, Semiglobal, and Global Interconnects in Gigascale Integrated Systems", Trans EDL, Vol. 54, Iss. 1, pp. 26-37, Jan 2007.
-
(2007)
Trans EDL
, vol.54
, Issue.ISS. 1
, pp. 26-37
-
-
Naeemi, A.1
Meindel, J.D.2
-
11
-
-
33845653224
-
Modeling of Metallic Carbon Nanotube Interconnects for Circuit Simulation and a Comparison with Cu Interconnects for Scaled Technologies
-
Jan
-
A. Raychowdhury, K. Roy, "Modeling of Metallic Carbon Nanotube Interconnects for Circuit Simulation and a Comparison with Cu Interconnects for Scaled Technologies," IEEE TCAD, Vol. 25, No. 12, pp. 3042-3044, Jan 2006.
-
(2006)
IEEE TCAD
, vol.25
, Issue.12
, pp. 3042-3044
-
-
Raychowdhury, A.1
Roy, K.2
-
12
-
-
34547293380
-
Performance Modeling and Optimization for Single- and Multi-Wall Carbon Nanotube Interconnects
-
A. Naeemi et al., "Performance Modeling and Optimization for Single- and Multi-Wall Carbon Nanotube Interconnects," Proc. DAC, pp. 568-573, 2007
-
(2007)
Proc. DAC
, pp. 568-573
-
-
Naeemi, A.1
-
13
-
-
34547819761
-
Analyzing Conductance of Mixed Carbon-Nanotube Bundles for Interconnect Applications
-
Aug
-
S. Haruehanroengra, W. Wang, "Analyzing Conductance of Mixed Carbon-Nanotube Bundles for Interconnect Applications", IEEE EDL, Vol. 28, No. 8, pp. 756-759, Aug 2007.
-
(2007)
IEEE EDL
, vol.28
, Issue.8
, pp. 756-759
-
-
Haruehanroengra, S.1
Wang, W.2
-
14
-
-
33947659332
-
Predicting the Performance and Reliability of Carbon Nanotube Bundles for On-Chip Interconnect
-
A. Nieuwoudt, M. Mondal, V. Massoud, "Predicting the Performance and Reliability of Carbon Nanotube Bundles for On-Chip Interconnect," IEEE ASPDAC, pp. 708-713, 2007.
-
(2007)
IEEE ASPDAC
, pp. 708-713
-
-
Nieuwoudt, A.1
Mondal, M.2
Massoud, V.3
-
15
-
-
0035920684
-
Reliability and current carrying capacity of carbon nanotubes
-
B. Q. Wei, R. Vajtai, P. M. Ajayan, "Reliability and current carrying capacity of carbon nanotubes," Appl. Phys. Lett., Vol. 79, No. 8, pp. 1172-1174, 2001.
-
(2001)
Appl. Phys. Lett
, vol.79
, Issue.8
, pp. 1172-1174
-
-
Wei, B.Q.1
Vajtai, R.2
Ajayan, P.M.3
-
16
-
-
4243956405
-
Thermal conductivity of single-walled carbon nanotubes
-
J. Hone, et al, "Thermal conductivity of single-walled carbon nanotubes," Phys. Rev., B, Vol. 59, No. 4, 1999.
-
(1999)
Phys. Rev., B
, vol.59
, Issue.4
-
-
Hone, J.1
-
17
-
-
33947245130
-
Modeling Crosstalk Effects in CNT Bus Architectures
-
Mar
-
D. Rossi, et al., "Modeling Crosstalk Effects in CNT Bus Architectures", IEEE Trans. NANO, Vol. 6, Iss. 2, pp. 133-145, Mar 2007
-
(2007)
IEEE Trans. NANO
, vol.6
, Issue.ISS. 2
, pp. 133-145
-
-
Rossi, D.1
-
18
-
-
34548138865
-
Assessing the Implications of Process Variations on Future Carbon Nanotube Bundle Interconnect Solutions
-
A. Nieuwoudt, Y. Massoud, "Assessing the Implications of Process Variations on Future Carbon Nanotube Bundle Interconnect Solutions," Proc. ISQED, pp. 119-126, 2007.
-
(2007)
Proc. ISQED
, pp. 119-126
-
-
Nieuwoudt, A.1
Massoud, Y.2
-
19
-
-
37749007934
-
Assessing Carbon Nanotube Bundle Interconnect for Future FPGA Architectures
-
S. Eachempati, et al., "Assessing Carbon Nanotube Bundle Interconnect for Future FPGA Architectures," Proc. DATE, pp. 1-6, 2007.
-
(2007)
Proc. DATE
, pp. 1-6
-
-
Eachempati, S.1
-
20
-
-
36349032609
-
Novel approach to fabricate carbon nanotube via interconnects using size-controlled catalyst nanoparticles, Proc
-
S. Sato et al., "Novel approach to fabricate carbon nanotube via interconnects using size-controlled catalyst nanoparticles," Proc. IITC, pp. 230-232, 2006.
-
(2006)
IITC
, pp. 230-232
-
-
Sato, S.1
-
21
-
-
1842482487
-
Can we achieve ultra-low resistivity in carbon nanotube-based metal composites?
-
May
-
O. Hjortstam, et al., "Can we achieve ultra-low resistivity in carbon nanotube-based metal composites?" App. Phy MSP, Vol. 78, No. 8, pp. 1175-1179, May 2004.
-
(2004)
App. Phy MSP
, vol.78
, Issue.8
, pp. 1175-1179
-
-
Hjortstam, O.1
-
22
-
-
34748917552
-
Modeling of the performance of carbon nanotube bundle, cu/low-k and optical on-chip global interconnects
-
B. Cho, et al., "Modeling of the performance of carbon nanotube bundle, cu/low-k and optical on-chip global interconnects", Proc. SLIP, pp. 81-88, 2007.
-
(2007)
Proc. SLIP
, pp. 81-88
-
-
Cho, B.1
-
23
-
-
33847406131
-
Physical modeling of temperature coefficient of resistance for single- and multiwall carbon nanotube interconnects
-
Feb
-
A. Naeemi, J. D. Meindl, "Physical modeling of temperature coefficient of resistance for single- and multiwall carbon nanotube interconnects," IEEE EDL, Vol.28, Iss. 2, pp. 135-138, Feb 2007.
-
(2007)
IEEE EDL
, vol.28
, Issue.ISS. 2
, pp. 135-138
-
-
Naeemi, A.1
Meindl, J.D.2
-
24
-
-
17044399632
-
Quantitative theory of nanowire and nanotube antenna performance
-
ArXiv Cond. Matter E-Prints, pp, Aug
-
P. J. Burke, "Quantitative theory of nanowire and nanotube antenna performance," ArXiv Cond. Matter E-Prints, pp. 1-14, Aug. 2004.
-
(2004)
, pp. 1-14
-
-
Burke, P.J.1
-
25
-
-
0034848826
-
Inductance 101: Modeling and Extraction
-
M. W. Beattie, L. T. Pileggi, "Inductance 101: Modeling and Extraction," Proc. DAC, pp. 323-328, 2001.
-
(2001)
Proc. DAC
, pp. 323-328
-
-
Beattie, M.W.1
Pileggi, L.T.2
-
26
-
-
0036502698
-
Multishell conduction in multiwalled carbon nanotubes
-
Mar
-
P. G. Collins, P. Avouris, "Multishell conduction in multiwalled carbon nanotubes," App. Phy. MSP, Vol. 74, No. 3, pp. 329-332, Mar. 2002.
-
(2002)
App. Phy. MSP
, vol.74
, Issue.3
, pp. 329-332
-
-
Collins, P.G.1
Avouris, P.2
-
28
-
-
25944438622
-
Electrical-Resistivity Model for Polycrystalline Films: The Case of Arbitrary Reflection at External Surfaces
-
A. F. Mayadas, M. Shatzkes, "Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External Surfaces," Phys. Review B, Vol. 1, Iss. 4, pp. 1382-1389, 1970.
-
(1970)
Phys. Review B
, vol.1
, Issue.ISS. 4
, pp. 1382-1389
-
-
Mayadas, A.F.1
Shatzkes, M.2
-
29
-
-
84933207793
-
The mean free path of electrons in metals
-
E. H. Sondheimer, "The mean free path of electrons in metals," Adv. Physics, vol. 1, no. 1, pp. 1-42, 1952.
-
(1952)
Adv. Physics
, vol.1
, Issue.1
, pp. 1-42
-
-
Sondheimer, E.H.1
-
30
-
-
0033875648
-
Physical Modeling of Spiral Inductors on Silicon
-
C. P. Yue, S. S. Wong, "Physical Modeling of Spiral Inductors on Silicon," Trans. EDL, Vol. 47, Iss. 3, pp. 560-568, 2000.
-
(2000)
Trans. EDL
, vol.47
, Issue.ISS. 3
, pp. 560-568
-
-
Yue, C.P.1
Wong, S.S.2
-
31
-
-
0032643283
-
Effects of Inductance on the Propagation Delay and Repeater Insertion in VLSI Circuits
-
Y. I. Ismail, et al. "Effects of Inductance on the Propagation Delay and Repeater Insertion in VLSI Circuits" Proc. DAC, pp.721-724, 1999.
-
(1999)
Proc. DAC
, pp. 721-724
-
-
Ismail, Y.I.1
-
32
-
-
0029179077
-
The SPLASH-2 programs: Characterization and methodological considerations
-
S.C. Woo et al. "The SPLASH-2 programs: Characterization and methodological considerations", Proc. ISCAS, pp. 24-36, 1995.
-
(1995)
Proc. ISCAS
, pp. 24-36
-
-
Woo, S.C.1
-
33
-
-
0038714099
-
Optimum Wire Sizing of RLC Interconnect with Repeaters
-
M. A. El-Moursy et al, "Optimum Wire Sizing of RLC Interconnect with Repeaters," Proc. GLSVLSI, pp. 27-32, 2003.
-
(2003)
Proc. GLSVLSI
, pp. 27-32
-
-
El-Moursy, M.A.1
-
34
-
-
51949104845
-
-
SystemC initiative
-
SystemC initiative. http://www.systemc.org.
-
-
-
-
35
-
-
4444364133
-
Extending the Transaction Level Modeling Approach for Fast Communication Architecture Exploration
-
S. Pasricha, N. Dutt, M. Ben-Romdhane, "Extending the Transaction Level Modeling Approach for Fast Communication Architecture Exploration", Proc. DAC, pp. 113-118, 2004.
-
(2004)
Proc. DAC
, pp. 113-118
-
-
Pasricha, S.1
Dutt, N.2
Ben-Romdhane, M.3
-
36
-
-
40549141807
-
-
S. Pasricha, N. Dutt, M. Ben-Romdhane, Fast Exploration of Bus-based Communication Architectures at the CCATB Abstraction, ACM TECS, 7, Iss. 2, pp. 22:1-22:32, Feb 2008
-
S. Pasricha, N. Dutt, M. Ben-Romdhane, "Fast Exploration of Bus-based Communication Architectures at the CCATB Abstraction", ACM TECS, Vol. 7, Iss. 2, pp. 22:1-22:32, Feb 2008
-
-
-
-
38
-
-
0742321357
-
Fixed-outline Floorplanning: Enabling Hierarchical Design
-
Dec
-
S. N. Adya, I. L. Markov, "Fixed-outline Floorplanning: Enabling Hierarchical Design", IEEE Trans TVLSI, Vol. 11, No. 6, pp. 1120-1135, Dec. 2003.
-
(2003)
IEEE Trans TVLSI
, vol.11
, Issue.6
, pp. 1120-1135
-
-
Adya, S.N.1
Markov, I.L.2
-
39
-
-
51949099950
-
Designing optimized pipelined global interconnects: Algorithms and methodology impact
-
V. Nookala, et al., "Designing optimized pipelined global interconnects: Algorithms and methodology impact," Proc. ISCAS, pp. 1-4, 2005.
-
(2005)
Proc. ISCAS
, pp. 1-4
-
-
Nookala, V.1
-
40
-
-
34447121993
-
Inductance of mixed carbon nanotube bundles
-
June
-
W. Wang, et al. "Inductance of mixed carbon nanotube bundles," Micro & Nano Letters, IET , Vol.2, No.2, pp.35-39, June 2007
-
(2007)
Micro & Nano Letters, IET
, vol.2
, Issue.2
, pp. 35-39
-
-
Wang, W.1
-
41
-
-
34748836557
-
Densification of Carbon Nanotube Bundles for Interconnect Application, Proc
-
Z. Liu et al., "Densification of Carbon Nanotube Bundles for Interconnect Application", Proc. IITC, pp. 201-203, 2007
-
(2007)
IITC
, pp. 201-203
-
-
Liu, Z.1
-
42
-
-
35348870939
-
Assembling Carbon Nanotube Bundles Using Transfer Process for Fine-Pitch Electrical Interconnect Applications
-
L. Zhu et al., "Assembling Carbon Nanotube Bundles Using Transfer Process for Fine-Pitch Electrical Interconnect Applications", Proc. EETC, pp. 1981-1985, 2007.
-
(2007)
Proc. EETC
, pp. 1981-1985
-
-
Zhu, L.1
|