Package structural integrity analysis considering moisture

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1054-1066

  Fan, Xuejun ^a,c   Zhou, Jiang ^a   Chandra, Abhijit ^b  

^a Lamar University   (United States)

^b Iowa State University of Science and Technology   (United States)

^c SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

HYGROSCOPIC SWELLING;

ABS RESINS; ADHESION; BOND STRENGTH (MATERIALS); BRAZING; COMPUTER NETWORKS; COUPLED CIRCUITS; ELASTICITY; ELECTRONIC EQUIPMENT TESTING; ERROR ANALYSIS; FLIP CHIP DEVICES; FRACTURE; FRACTURE MECHANICS; INORGANIC COATINGS; INTERFEROMETRY; MOISTURE; MOISTURE METERS; NONLINEAR ANALYSIS; ORES; PHOTORESISTS; POLYIMIDES; POLYMERS; RELIABILITY; RELIABILITY ANALYSIS; SILICON; SOLDERING; STRENGTH OF MATERIALS; STRESS ANALYSIS; STRESSES; WELDING;

FINITE ELEMENT METHOD;

EID: 51449096086     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550106     Document Type: Conference Paper

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