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Volumn 11, Issue 2, 1996, Pages 155-162

Corrosion-induced degradation of microelectronic devices

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC OXIDATION; CORROSION; DEGRADATION; ELECTRONICS INDUSTRY; INTEGRATED CIRCUITS; METALLIZING; PH; RELIABILITY; THERMODYNAMICS;

EID: 0030086024     PISSN: 02681242     EISSN: None     Source Type: Journal    
DOI: 10.1088/0268-1242/11/2/002     Document Type: Review
Times cited : (56)

References (18)
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  • 5
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    • The effect of impurities on corrosion of aluminium metallization
    • New York: IEEE
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    • Paulson, W.M.1    Lorigan, R.P.2
  • 6
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    • Gordan Davy J 1975 Calculations for leak rates of hermetic packages IEEE Trans. Parts Hybrids Packaging 11 177
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    • Gordan, D.J.1
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    • New York: IEEE
    • Stroehle D 1977 On the penetration of gases and water vapour Int. Reliability Physics Symp. (New York: IEEE) p 101
    • (1977) Int. Reliability Physics Symp. , pp. 101
    • Stroehle, D.1
  • 8
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    • Environmental testing component reliability observations of telecommunications equipment operated in tropical climatic conditions
    • Sinnadurai N, Kuppuswamy T S, Chandrarrouli R, and Rao BKN 1992 Environmental testing component reliability observations of telecommunications equipment operated in tropical climatic conditions Quality Reliab. Eng. Int. 8 189
    • (1992) Quality Reliab. Eng. Int. , vol.8 , pp. 189
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  • 9
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    • A survey of corrosion failure mechanisms in microelectronic devices
    • Schnable G L, Comizzoli B L, Kern W, and White L K 1979 A survey of corrosion failure mechanisms in microelectronic devices RCA Rev. 40 416
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    • Schnable, G.L.1    Comizzoli, B.L.2    Kern, W.3    White, L.K.4
  • 11
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    • Moisture-induced aluminium corrosion and stress on the chip in plastic-encapsulated LSI's
    • New York: IEEE
    • Inayoshi H, Nishi K, Okikawa S, and Washima Y 1987 Moisture-induced aluminium corrosion and stress on the chip in plastic-encapsulated LSI's Int. Reliability Physics Symp. (New York: IEEE) p 113
    • (1987) Int. Reliability Physics Symp. , pp. 113
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  • 12
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    • Failure mechanisms in molded microelectronic packages
    • Feinstein L C 1979 Failure mechanisms in molded microelectronic packages Semicond. Int. 51
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  • 13
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    • Conductive anodic filaments in reinforced polymeric dielectrics: Formation and prevention
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.