Transient analysis on hygroscopic swilling characterization using sequentially coupled moisture diffusion and hygroscopic stress modeling approach

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 5, Issue , 2005, Pages 107-114

  Zhou, Jiang ^a   Tee, Tong Yan ^b   Zhang, Xueren ^b  

^a Lamar University   (United States)

^b STMICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

HYGROSCOPIC STRESS; HYGROSCOPIC SWELLING; MOISTURE DIFFUSION;

DEFORMATION; ELASTICITY; MOISTURE DETERMINATION; STRAIN; STRESS ANALYSIS;

SWELLING;

EID: 33645076036     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2005-81847     Document Type: Conference Paper

References (13)

1. Wong, E. H., Rajoo, R., Lim, "Moisture absorption and distribusion characterisation of packaging materials-advanced treatment," Microelectronics Reliablity, 2003 (43), pp. 2087-2096.
2. Wong, E. H., Chan, K. C., Rajoo, R., Lim, T.B., "The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging," Proc. 50th Electron. Comp. Technol. Conf., Las Vegas, NV, 2000, pp. 576-580.
3. Tee, T. Y., Kho, C. I., Yap, D., Toh, C., Baraton, X., Zhong, Z., "Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill" Microelectronics Reliablity, 2003, pp. 741-749.
4. Tee, T.Y., Zhong, Z., "Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during re.ow with interfacial fracture mechanics analysis" Microelectronics Reliability, 2004, pp.105-114
5. Stellrecht, E., Han, B., Pecht, M. G., "Characterzation of Hygroscopic swelling behavior of mold compounds and plastic packages," IEEE transactions on Components and Packing Technologies, 2004, pp. 499-506.
6. Zhou, J., "Investigation of inner-layer dielectric (ILD) failure by hygroscopic swelling," IEEE 55th Electronic Components and Technology Conference (ECTC), May 31 - June 4, 2005, Orlando
7. Zhou, J., Lahoti, S., and Sitlani, M., "Investigation of Non-Uniform Moisture Distribution on Determination of Hygroscopic Swelling Coefficient and Finite Element Modeling for a Flip Chip Package," IEEE International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-System (EuroSime)s, pp. 118-126, April 17-20, 2005, Berlin, Germany
8. Ardebelli, H., Wong E.H., and Pecht, M., "Hygroscopic Swelling and Sorption Characteristics of Epoxy Molding Compounds Used in Electronic Packaging," IEEE Trans. Comp. Packag. Technol., vol. 26, pp. 206-214, Mar. 2003.
9. Tay, A. A. O., and Lin, T.Y., "Influence of temperature, humidity and defect location on delamination in plastics packages, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, 22, no. 4, pp. 512-518, 1999.
10. Lin, T. Y., and Tay, A.A.O., "Dynamics of Moisture Diffusion, Hygrothermal Stresses and delamination in Plastic IC Packages", ASME EEP-Vol. 19-1, Advances in Electronic Packaging, pp. 1429-1436, 1997.
11. Tay, A.A.O. and Lin, T.Y., "Moisture Diffusion and Heat Transfer in Plastic IC Packages", IEEE Transactions on Components, Packaging and Manufacturing Technology -. Part-A, vol. 19, no. 2, pp.186-193, 1996.
12. th Electronic Components and Technology Conference, pp. 830-836, 1999
13. J.E. Galloway, and B.M. Miles, Moisture Absorption and Desorption Predictions for Plastic Ball Grid Array Packages, IEEE Transactions on Components, Packaging and Manufacturing Technology -. Part-A, 20(3), pp. 274-279, 1997.