Effect of hygrothermal aging on interfacial reliability of silicon/ underfill/FR-4 assembly

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 1, 2008, Pages 94-103

  Shi, Xunqing Q ^a   Zhang, Yanlie L ^b   Zhou, Wei ^b   Fan, Xuejun J ^c  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c Lamar University   (United States)

Author keywords

Coefficient of thermal expansion (CTE); Flip chip on board (FCOB); Input output (L O)

Indexed keywords

DEFORMATION; FLIP CHIP DEVICES; FRACTURE TOUGHNESS; STRENGTH OF MATERIALS; SWELLING; THERMAL AGING; THERMAL CYCLING; THERMAL EXPANSION;

FLIP CHIP ON BOARD (FCOB); FLIP CHIP PACKAGE; HYGROTHERMAL AGING; HYGROTHERMAL SWELLING;

ELECTRONICS PACKAGING;

EID: 41349103030     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.916801     Document Type: Article

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