Interfacial delamination mechanisms during soldering reflow with moisture preconditioning

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 2 SPEC. ISS., 2008, Pages 252-259

  Fan, Xuejun ^a,b   Zhang, G Q ^c   van Driel, Willem D ^c   Ernst, Leo J ^d  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^b LAMAR UNIVERSITY   (United States)

^c NXP SEMICONDUCTORS   (Netherlands)

^d DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Interface delamination; Moisture diffusion; Moisture sensitivity; Underfill; Vapor pressure

Indexed keywords

ADHESION STRENGTHS; BGA PACKAGES; CRITICAL STRESS; DESIGNED EXPERIMENTS; DIFFERENT DISTRIBUTIONS; ELEVATED TEMPERATURES; FLIP CHIPS; FLIP-CHIP PACKAGES; HIGH TEMPERATURES; INTERFACE DELAMINATION; INTERFACE PROPERTIES; INTERFACIAL ADHESIONS; INTERFACIAL DELAMINATIONS; MECHANISM ANALYSIS; MODEL STUDIES; MOISTURE ABSORPTIONS; MOISTURE CONCENTRATIONS; MOISTURE DIFFUSION; MOISTURE PRECONDITIONING; MOISTURE SENSITIVITY; MULTI-SCALE; PRESSURE LEVELS; REFLOW TEMPERATURES; TEST DATUM; THERMAL MISMATCHES; UNDERFILL; UNDERFILLS; UNSTABLE VOID GROWTHS; VAPOR PRESSURE MODELS;

ABSORPTION; ADHESION; BRAZING; DELAMINATION; DIFFUSION; FLIP CHIP DEVICES; HYDROSTATIC PRESSURE; STEEL SHEET; VAPOR PRESSURE; VAPORS; WELDING;

MOISTURE;

EID: 65349171732     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.921629     Document Type: Conference Paper

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