Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill

Microelectronics Reliability

Volumn 43, Issue 5, 2003, Pages 741-749

  Tee, Tong Yan ^a   Kho, Chek Lim ^a   Yap, Daniel ^a   Toh, Carol ^a   Baraton, Xavier ^a   Zhong, Zhaowei ^b  

^a STMICROELECTRONICS   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; FLIP CHIP DEVICES; INTERFACES (MATERIALS); METALLIZING; MOISTURE; RELIABILITY; SUBSTRATES; SWELLING; THERMAL STRESS;

NO-FLOW UNDERFILL;

MICROELECTRONICS;

EID: 0038326650     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00035-0     Document Type: Article

References (13)

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