Moisture absorption analysis of interfacial fracture test specimens composed of no-flow underfill materials

Journal of Electronic Packaging

Volumn 125, Issue 1, 2003, Pages 24-30

  Ferguson, Timothy ^a   Qu, Jianmin ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; DIFFUSION; FRACTURE TESTING; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); MOISTURE;

INTERFACIAL FRACTURE TEST; MOISTURE ABSORPTION ANALYSIS; UNDERFILL MATERIALS;

ELECTRONICS PACKAGING;

EID: 0345413276     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1524132     Document Type: Article

References (9)

1. Soles, C., and Yee, A., 2000, "A Discussion of the Molecular Mechanisms of Moisture Transport in Epoxy Resins," J. Polym. Sci., Part B: Polymer Physics, 38, pp. 792-802.
2. Soles, C., Chang, T., Gidley, D., and Yee, A., 2000, "Contributions of the Nanovoid Structure to the Kinetics of Moisture Transport in Epoxy Resins," J. Polym. Sci., Part B: Polymer Physics, 38, pp. 776-791.
3. Ferguson, T., and Qu, J., 2001, "Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface," ASME J. Electron. Packag. 124, pp. 106-110.
4. Crank, J., 1956, The Mathematics of Diffusion, Clarendon Press, Oxford, UK.
5. Shi, S., 2000, "Study on No-Flow Underfill Materials for Low-Cost Flip-Chip Applications," doctoral thesis, Georgia Institute of Technology, School of Materials Science Engineering, Atlanta, GA.
6. Wong, C. P., Shi, S., and Jefferson, G., 1997, "High Performance No-Flow Underfills for Low-Cost Flip-Chip Applications," IEEE Electronic Components and Technology Conference, pp. 850-858.
7. Vanlandingham, M., Eduljee, R. F., and Gillespie, J. W., 1999, "Moisture Diffusion in Epoxy Systems," J. Appl. Polym. Sci., 71, pp. 787-798.
8. Shen, C. H., and Springer, G. S., 1976, "Moisture Absorption and Desorption of Composite Materials," J. Compos. Mater., 10, pp. 2-10.
9. Wong, E. H., Chan, K. C., Lim, T. B., and Lam, T. F., 1999, "Non-Fickian Moisture Properties Characterization and Diffusion Modeling for Electronic Packages," Proc. 49th IEEE ECTC, pp. 302-306.