Integrated electrical, optical, and thermal high density and compliant wafer-level chip I/O interconnections for gigascale integration

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 1-6

  Bakir, Muhannad S ^a   Meindl, James D ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION (CTE); ELECTRICAL PILLARS; GIGASCALE INTEGRATION (GSI); POLYMER PILLARS;

ELECTRON MICROSCOPES; FLOW OF FLUIDS; LARGE SCALE SYSTEMS; METALLIZING; MICROELECTRONICS; MICROPROCESSOR CHIPS; MIRRORS; PHOTONS; POLYMERS; SCANNING ELECTRON MICROSCOPY; THERMAL EXPANSION; TRANSISTORS; WAVEGUIDES;

WSI CIRCUITS;

EID: 4944251594     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. International Technology Roadmap for Semiconductors, 2003 ed., SIA
2. M. Bakir, B. Dang, R. Emery, G. Vandentop, K. Martin, P. Kohl, and J. Meindl, "Chip integration of Sea of Leads compliant I/O interconnections for the ultimate enabling of chips with low-k interlayer dielectrics," in Proc. Electronic Components and Technol. Conf., 2004
3. M. Bakir, H. Reed, H. Thacker, C. Patel, P. Kohl, K. Martin, and J. Meindl, "Sea of Leads (SoL) ultrahigh density wafer-level chip input/ output interconnections for gigascale integration (GSI)," IEEE Trans. Electron Devices, vol. 50, no. 10, pp. 2039-2048.
4. S. Gurrum, S. Suman, Y. Joshi, and A. Fedorov, "Thermal issues in next generation integrated circuits," in Proc. Int. Electronic Packaging Technical Conf. and Exhibition (InterPack), 2003.
5. M. Bakir, T. Gaylord, K. Martin, and J. Meindl, "Sea of polymer pillars: compliant wafer-level electrical-optical chip I/O interconnections," IEEE Photon. Technol Lett., vol. 15, no. 11, pp.1567-1569, Nov. 2003.
6. M. Bakir, T. Gaylord, O. Ogunsola, E. Glytsis, and J. Meindl, "Optical transmission of polymer pillars for chip I/O optical interconnections," IEEE Photon. Technol. Lett., vol. 16, no. 1, pp. 117-119, Jan. 2004.
7. R. Chen, L. Lin, C. Choi, Y. Liu, B. Bihari, L. Wu, S. Tang, R. Wickman, B. Picor, M. Hibbs-Brenner, J. Bristow, and Y. Liu, "Fully embedded board-level guided-wave optoelectronic interconnects," Proc. IEEE, vol. 88, no. 6, pp. 780-793, Jun. 2000.