-
1
-
-
0028758513
-
-
J. Welser, J. L. Hoyt, S. Takagi, and J. F. Gibbons, Tech. Dig.-Int. Electron Devices Meet. 1994, 373.
-
Tech. Dig. - Int. Electron Devices Meet.
, vol.1994
, pp. 373
-
-
Welser, J.1
Hoyt, J.L.2
Takagi, S.3
Gibbons, J.F.4
-
2
-
-
33747106589
-
-
J. Huang, M. J. Kim, P. R. Chidambaram, R. B. Irwin, P. J. Jones, J. W. Weijtmans, E. M. Koontz, Y. G. Wang, S. Tang, and R. Wise, Appl. Phys. Lett. 89, 063114 (2006).
-
(2006)
Appl. Phys. Lett.
, vol.89
, pp. 063114
-
-
Huang, J.1
Kim, M.J.2
Chidambaram, P.R.3
Irwin, R.B.4
Jones, P.J.5
Weijtmans, J.W.6
Koontz, E.M.7
Wang, Y.G.8
Tang, S.9
Wise, R.10
-
3
-
-
33750148553
-
-
P. Zhang, A. A. Istratov, E. R. Weber, C. Kisielowski, H. He, C. Nelson, and J. C. H. Spence, Appl. Phys. Lett. 89, 161907 (2006).
-
(2006)
Appl. Phys. Lett.
, vol.89
, pp. 161907
-
-
Zhang, P.1
Istratov, A.A.2
Weber, E.R.3
Kisielowski, C.4
He, H.5
Nelson, C.6
Spence, J.C.H.7
-
4
-
-
0142154781
-
-
K. Usuda, T. Numata, T. Tezuka, N. Sugiyama, Y. Moriyama, S. Nakaharai, and S. Takagi, IEEE International SOI Conference., 2003, pp. 138-139.
-
(2003)
IEEE International SOI Conference
, pp. 138-139
-
-
Usuda, K.1
Numata, T.2
Tezuka, T.3
Sugiyama, N.4
Moriyama, Y.5
Nakaharai, S.6
Takagi, S.7
-
5
-
-
51349166863
-
-
Microsc Microanal. 12, 836 CD (2007).
-
C. B. Vartuli, K. Jarausch, H. Inada, R. Tsuneta, D. J. Dingley, and E. A. Marley, Microsc Microanal. 12, 836 CD (2007).
-
-
-
Vartuli, C.B.1
Jarausch, K.2
Inada, H.3
Tsuneta, R.4
Dingley, D.J.5
Marley, E.A.6
-
6
-
-
17044429048
-
-
K.-W. Ang, K.-J. Chui, V. Bliznetsov, C.-H. Tung, A. Du, N. Balasubramanian, G. Samudra, M. F. Li, and Y.-C. Yeo, Appl. Phys. Lett. 86, 093102 (2005).
-
(2005)
Appl. Phys. Lett.
, vol.86
, pp. 093102
-
-
Ang, K.-W.1
Chui, K.-J.2
Bliznetsov, V.3
Tung, C.-H.4
Du, A.5
Balasubramanian, N.6
Samudra, G.7
Li, M.F.8
Yeo, Y.-C.9
-
11
-
-
33646043420
-
-
S. E. Thompson, G. Sun, Y. S. Choi, and T. Nishida, IEEE Trans. Electron Devices 53, 1010 (2006).
-
(2006)
IEEE Trans. Electron Devices
, vol.53
, pp. 1010
-
-
Thompson, S.E.1
Sun, G.2
Choi, Y.S.3
Nishida, T.4
-
14
-
-
0003718128
-
-
(Wiley, New York, 1998).
-
D. C. Ghiglia and M. D. Pritt, Two-Dimensional Phase Unwrapping: Theory, Algorithms, and Software (Wiley, New York, 1998).
-
Two-Dimensional Phase Unwrapping: Theory, Algorithms, and Software
-
-
Ghiglia, D.C.1
Pritt, M.D.2
-
16
-
-
51349153573
-
-
in Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits and Applications of SiGe and SI Strained-Layer Epitaxy, edited by J. D. Cressler (CRC, Boca Raton, 2005)
-
S. E. Thompson, in Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits and Applications of SiGe and SI Strained-Layer Epitaxy, edited by, J. D. Cressler, (CRC, Boca Raton, 2005), pp. 601-614.
-
-
-
Thompson, S.E.1
-
17
-
-
33846032325
-
-
S. Suthram, J. C. Ziegert, T. Nishida, and S. E. Thompson, IEEE Electron Device Lett. 28, 58 (2007).
-
(2007)
IEEE Electron Device Lett.
, vol.28
, pp. 58
-
-
Suthram, S.1
Ziegert, J.C.2
Nishida, T.3
Thompson, S.E.4
-
18
-
-
33746556858
-
-
H. Lin, H. Chen, C. Ko, C. Ge, H. Lin, T. Huang, and W. Lee, IEEE Electron Device Lett. 27, 659 (2006).
-
(2006)
IEEE Electron Device Lett.
, vol.27
, pp. 659
-
-
Lin, H.1
Chen, H.2
Ko, C.3
Ge, C.4
Lin, H.5
Huang, T.6
Lee, W.7
-
19
-
-
42449161474
-
-
F. Hüe, M. Htch, H. Bender, F. Houdellier, and A. Claverie, Phys. Rev. Lett. 100, 156602 (2008).
-
(2008)
Phys. Rev. Lett.
, vol.100
, pp. 156602
-
-
Hüe, F.1
Htch, M.2
Bender, H.3
Houdellier, F.4
Claverie, A.5
-
20
-
-
45749105563
-
-
M. Htch, F. Houdellier, F. Hüe, and E. Snoeck, Nature (London) 453, 1086 (2008).
-
(2008)
Nature (London)
, vol.453
, pp. 1086
-
-
Htch, M.1
Houdellier, F.2
Hüe, F.3
Snoeck, E.4
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