Additive-free superfilling in damascene Cu electrodeposition using microcontact printing

Electrochemical and Solid-State Letters

Volumn 7, Issue 9, 2004, Pages

  Kim, Soo Kil ^a   Kim, Jae Jeong ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ADSORPTION; ATOMIC FORCE MICROSCOPY; CHEMICAL VAPOR DEPOSITION; COPPER; ELECTRIC CURRENTS; ELECTROLYTES; ELECTRON TUNNELING; PHYSICAL VAPOR DEPOSITION; POLYETHYLENE GLYCOLS; SELF ASSEMBLY;

ADDITIVE-FREE SUPERFILLING; CALOMEL REFERENCE ELECTRODES (SCE); CURVATURE ENHANCED ACCELERATOR COVERAGE (CEAC); POLY(DIMETHYLSILOXANE) (PDMS); SELF ASSEMBLED MONOLAYERS (SAM); TUNNELING CURRENTS;

ELECTRODEPOSITION;

EID: 4944253002     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1778932     Document Type: Article

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