Microcontact printing of catalytic nanoparticles for selective electroless deposition of metals on nonplanar polymeric substrates

Applied Physics Letters

Volumn 81, Issue 16, 2002, Pages 3097-3099

  Ng, W K ^a   Wu, L ^a   Moran, P M ^a  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYTIC NANOPARTICLE; CATALYTIC PARTICLES; CHEMICALLY MODIFIED; METAL PATTERNS; MICRO CONTACT PRINTING; POLYMER SUBSTRATE; POLYMER SURFACES; POLYMERIC SUBSTRATE; PRINTING PROCESS; SELECTIVE ELECTROLESS PLATING; SUBSTRATE SURFACE;

ELECTROLESS PLATING; ELECTRON DEVICE MANUFACTURE; NANOPARTICLES; PRINTING; SUBSTRATES;

POLYMERS;

EID: 79956007504     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1513184     Document Type: Article

References (19)

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13. w∼200000 and 4000) and softening temperature 60°C-93°C, we have found plating when the stamp was not heated and the polystyrene was heated to only 170°C.
14. XPS analyses of the stamp before and after printing have shown that up to 80% of the nanoparticles can be transferred during printing. It should be noted, however, that particle transfer is not yet consistent.
15. The nickel-plating solution used in this case was an "in-house" midphosphorous solution using sodium hypophosphite as a reducing agent. The solution was used at 90°C and had a pH of 5. We have also successfully used commercial solutions.
16. The method should also work on other polymeric substrates. In the case of thermoset polymers, for example, printing could be done on uncured or partially cured substrates and the stamp and substrate could be separated after curing is complete. However, as was the case with polystyrene substrates, a certain amount of trial and error would be necessary. Even when printing on polystyrene substrates, the method does not yet produce consistent results.
17. Removing the catalytic particles from the raised regions of the stamp can be achieved by bringing the inked stamp into contact with a rigid dummy substrate or adhesive layer prior to molding. Thereby, the catalytic particles remain only in the recessed areas of the stamp. Upon stamping/molding, the particles would then be transferred to what would be the raised regions of the substrate.
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