Advanced tungsten plug process for beyond nanometer technology

Microelectronic Engineering

Volumn 85, Issue 8, 2008, Pages 1739-1747

  Luoh, Tuung ^a   Su, Chin Ta ^a   Yang, Ta Hung ^a   Chen, Kuang Chao ^a   Lu, Chih Yuan ^a  

^a MACRONIX INTERNATIONAL CO LTD   (Taiwan)

Author keywords

Atomic layer deposition; Contact size; Grain size; High aspect ratio; Resistivity; Tungsten nucleation layer; Tungsten plug

Indexed keywords

EPITAXIAL GROWTH; NUCLEATION; PHYSICAL VAPOR DEPOSITION; PULSED LASER DEPOSITION; TUNGSTEN;

(E ,3E) PROCESS; ATOMIC LAYER DEPOSITION (ATL); NANOMETER TECHNOLOGIES; NUCLEATION LAYER (NL); TUNGSTEN PLUG; W-PLUG FILL PROCESSES;

ATOMIC LAYER DEPOSITION;

EID: 48949116084     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.04.030     Document Type: Article

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