Pulsed CVD of tungsten thin film as a nucleation layer for tungsten plug-fill

Electrochemical and Solid-State Letters

Volumn 7, Issue 9, 2004, Pages

  Kim, Soo Hyun ^a   Hwang, Eui Sung ^a   Han, Sang Yup ^a   Pyi, Seung Ho ^a   Kawk, Nohjung ^a   Sohn, Hyunchul ^a   Kim, Jinwoong ^a   Choi, Gi Bo ^b  

^a Hynix Semiconductor Inc   (South Korea)

^b Applied Materials Korea   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ELECTRODEPOSITION; GRAIN SIZE AND SHAPE; NUCLEATION; SURFACE ROUGHNESS; TRANSMISSION ELECTRON MICROSCOPY; TUNGSTEN;

ATOMIC LAYER DEPOSITION (ALD); TOPOGRAPHIC STRUCTURES;

THIN FILMS;

EID: 4944228363     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1784053     Document Type: Article

References (11)

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