Stencil-assisted reactive ion etching for micro and nano patterning

Microelectronic Engineering

Volumn 85, Issue 8, 2008, Pages 1705-1708

  Viallet, B ^a   Grisolia, J ^a   Ressier, L ^a   Van Den Boogaart, M A F ^b   Brugger, J ^b   Lebraud, T ^a  

^a INSA   (France)

^b EPFL   (Switzerland)

Author keywords

Lithography; Nanoparticles; Reactive ion etching; Stencil

Indexed keywords

ETCHING; IONS; LITHOGRAPHY; METALS; OPTICAL DESIGN; OXYGEN; SELF ASSEMBLED MONOLAYERS;

(E ,3E) PROCESS; CONVENTIONAL LITHOGRAPHY; ELSEVIER (CO); LATEX NANOPARTICLES; LIFT-OFF PROCESSES; LITHOGRAPHY PROCESSES; MICRO AND NANO PATTERNING; NANOMETRIC; OPTICAL RADIATIONS; ORGANIC MATERIALS; REACTIVE ION; SELF ASSEMBLED MONOLAYERS (SAMS);

REACTIVE ION ETCHING;

EID: 48949116082     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.04.027     Document Type: Article

References (24)

1. Randall J.N., Flanders D.C., Economou P.N., Donnelly J.P., and Bromley E.I. Appl. Phys. Lett. 42 (1982) 457
2. Kaminsky G. J. Vac. Sci. Technol. B 3 (1985) 741
3. Graff M., Mohanty S.K., and Frazier A.B. J. Microelectromech. Syst. 13 (2004) 956
4. Deshmukh M.M., Ralph D.C., Thomas M., and Silcox J. Appl. Phys. Lett. 75 (1999) 1631
5. Kim G., Kim B., and Brugger J. Sens. Actuators, A 107 (2003) 132
6. J. Arcamone, M. van den Boogaart, F. Serra-Graells, S. Hansen, J. Brugger, F. Torres, G. Abadal, N. Barniol, G. Pérez-Murano, in: IEEE International Electron Devices Meeting, San Francisco, USA, 2006.
7. Tixier A., Mita Y., Gouy J.P., and Fujita H. J. Micromech. Microeng. 10 (2000) 157
8. Bruenger W.H., Torkle M., Leung K.N., Lee Y., Williams M.D., Loeschner H., Stengl G., Fallmann W., Paschke F., Stangl G., Rangelow I.W., and Hudek P. Microelectron. Eng. 46 (1999) 477
9. Hirscher S., Kummel M., Kirch O., Domke W.-D., Wolter A., Kasmaier R., Buschbeck H., Cekan E., Chalupka A., Chylik A., Eder S., Horner C., Loschner H., Nowak R., Stengl G., Windischbauer T., and Zeininger M. Microelectron. Eng. 61-62 (2002) 301
10. Sohda Y., Ohta H., Murai F., Yamamoto J., Kawano H., Satoh H., and Itoh H. Microelectron. Eng. 66-67 (2003) 78
11. Shibata T., Suguro K., Sugihara K., Nishihashi T., Fujiyama J., and Sakurada Y. IEEE Trans. Semicond. Manuf. 15 (2002) 183
12. Dumas C., Grisolia J., Ressier L., Arbouet A., Paillard V., Ben Assayag G., Claverie A., van den Boogaart M.A.F., and Brugger J. Phys. Status Solidi A 204 (2007) 487-491
13. Sandstrom R.L., Pezeshki B., Agahi F., Martel R., and Crockett J.G. Appl. Phys. Lett. 69 (1996) 2163
14. Cho B.-O., Ryu J.-H., Hwang S.-W., and Lee G.-R. J. Vac. Sci. Technol. B 18 (2000) 2769
15. Sankaran R.M., and Giapis K.P. Appl. Phys. Lett. 79 (2001) 593
16. Van Den Boogaart M.A.F., Kim G.M., Pellens R., Van Den Heuvel J.-P., and Brugger J. J. Vac. Sci. Technol. B 22 (2004) 3174
17. Andries B., Ravel G., and Peccoud L. J. Vac. Sci. Technol. A 7 (1989) 2774
18. Lishchynska M., Bourenkov V., van den Boogaart M.A.F., Doeswijk L., Brugger J., and Greer J.C. Microelectron. Eng. 84 (2007) 42
19. Ressier L., Martin C., and Peyrade J.P. Microelectron. Eng. 71 (2004) 272
20. Ressier L., Viallet B., Grisolia J., and Peyrade J.P. J. Vac. Sci. Technol. B 25 (2007) 17
21. Dimitrov A.S., and Nagayama K. Langmuir 12 (1996) 1303
22. Prevo B.G., and Velev O.D. Langmuir 20 (2004) 2099
23. Lange B., Zentel R., Ober C., and Marder S. Chem. Mater. 16 (2004) 5286
24. Ferrand P., Egen M., Zentel R., Seekamp J., Romanov S.G., and Sotomayor Torres C.M. Appl. Phys. Lett. 83 (2003) 5289