The characteristics of electromigration and thermomigration in flip chip solder joints

Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC

Volumn , Issue , 2007, Pages 43-47

  Yang, Dan ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COMPUTER SIMULATION; CURRENT DENSITY; ELECTROMIGRATION; METALLIZING; TIN; TITANIUM COMPOUNDS; WELDING;

CURRENT CROWDING EFFECTS; DIFFUSIVITY; ELECTRON FLOWS; FLIP CHIP SOLDER JOINTS; HEAT ACCUMULATION; LOCAL CURRENT DENSITY; LOCAL TEMPERATURES; NUMERICAL SIMULATIONS; SOLDER INTER CONNECTIONS; SOLDER JOINTS; TEMPERATURE COEFFICIENT OF RESISTANCE; THERMAL INFRARED; THERMOMIGRATION;

LEAD;

EID: 48049122877     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/THERMINIC.2007.4451744     Document Type: Conference Paper

References (17)

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