Percolation theory applied to the analysis of thermal interface materials in flip-chip technology

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2000, Pages 21-28

  Devpura, Amit ^a   Phelan, Patrick E ^a   Prasher, Ravi S ^a  

^a ARIZONA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACTS (FLUID MECHANICS); ELECTRONICS PACKAGING; HEAT CONDUCTION; HEAT LOSSES; HEAT RESISTANCE; HEAT SINKS; MATHEMATICAL MODELS; PERCOLATION (FLUIDS); POLYMERS; THERMAL CONDUCTIVITY; THERMODYNAMICS;

CONTACT RESISTANCE; THERMAL GREASE; THERMAL INTERFACE MATERIALS; THERMAL POLYMERS;

FLIP CHIP DEVICES;

EID: 0033694254     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (13)