Random network percolation models for particulate thermal interface materials

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 1192-1198

  Kanuparthi, S ^a   Zhang, X ^a,c   Subbarayan, G ^a   Sammakia, B G ^b   Siegmund, T ^a   Gowda, A ^c   Tonapi, S ^c  

^a PURDUE UNIVERSITY   (United States)

^b BINGHAMTON UNIVERSITY   (United States)

^c GE GLOBAL RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FULL-FIELD SIMULATIONS; RANDOM NETWORK MODELS; THERMAL INTERFACE MATERIALS (TIM);

COMPUTER SIMULATION; ELECTRIC CONTACTS; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; MICROSTRUCTURE; PERCOLATION (SOLID STATE); RANDOM PROCESSES; THERMAL INSULATING MATERIALS; WASTE HEAT;

INTERFACES (MATERIALS);

EID: 33845562296     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645480     Document Type: Conference Paper

References (12)

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