Thermal resistance-based bounds for the effective conductivity of composite thermal interface materials

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 2006, Issue , 2006, Pages 28-36

  Karayacoubian, P ^a   Yovanovich, M M ^a   Culham, J R ^a  

^a UNIVERSITY OF WATERLOO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MATERIALS; COMPUTER SIMULATION; COOLING SYSTEMS; DISPERSIONS; HEAT RESISTANCE; LUBRICATING GREASES; THERMAL CONDUCTIVITY;

CONDUCTIVE PARTICLES; HEAT FLOW; MICROELECTRONICS COOLING APPLICATIONS; THERMAL INTERFACE MATERIAL (TIM);

INTERFACES (MATERIALS);

EID: 33750117067     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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