Comparison of thermal performance of current high-end thermal interface materials

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 1, Issue , 2007, Pages 399-404

  Refai Ahmed, Gamai ^a,b   He, Zhaojuan ^c   Heian, Ellen ^c   Vincent, Ramzi ^c   Rude, Tim ^c   Van Heerden, David ^c  

^a ASME

^b AMD Inc   (Canada)

^c Reactive NanoTechnologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND LINE THICKNESS; EXOTHERMIC MIXING; GRAPHICS PROCESSORS; REACTIVE NANO-TECHNOLOGIES (RNT);

HEAT SINKS; MULTILAYERS; NANOTECHNOLOGY; PROGRAM PROCESSORS; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS;

INTERFACES (MATERIALS);

EID: 40449110515     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33383     Document Type: Conference Paper

References (13)