Pulse electroplating of copper film: A study of process and microstructure

Journal of Nanoscience and Nanotechnology

Volumn 8, Issue 5, 2008, Pages 2568-2574

  Zhang, Xi ^a   Tu, K N ^a   Chen, Zhong ^b   Tan, Y K ^b   Wong, C C ^b   Mhaisalkar, S G ^b   Li, X M ^c,d   Tung, C H ^c   Cheng, C K ^c  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c INSTITUTE OF MICROELECTRONICS   (Singapore)

^d WinTech Nano Technology Services Pte Ltd   (Singapore)

Author keywords

Grain recrystallization and growth; Nanoscale twinning; Pulse electrodeposition

Indexed keywords

ANNEALING; DEPOSITS; ELECTRODES; ELECTROPLATING; METALLIC FILMS; NANOTECHNOLOGY; RECRYSTALLIZATION (METALLURGY); TEXTURES; TOPOGRAPHY;

ELECTRICAL CONDUCTIVITY; GRAIN RECRYSTALLIZATION; HIGH MECHANICAL STRENGTH; NANO SCALE; PEAK CURRENT DENSITY; PULSE ELECTRODEPOSITION; RANDOM MICROSTRUCTURE; SELF-ANNEALING EFFECTS;

COPPER;

EID: 45849136391     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

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