Textures of thin copper films

Journal of Materials Research

Volumn 13, Issue 10, 1998, Pages 2962-2968

  Kuschke, W M ^a   Kretschmann, A ^a   Keller, R M ^a   Vinci, R P ^b   Kaufmann, C ^c   Arzt, E ^a  

^a UNIVERSITY OF STUTTGART   (Germany)

^b Stanford University   (United States)

^c CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHEMICAL VAPOR DEPOSITION; COPPER; DIFFUSION IN SOLIDS; STRESS ANALYSIS; TEXTURES; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

PHYSICAL VAPOR DEPOSITION; WAFER CURVATURE TECHNIQUE;

METALLIC FILMS;

EID: 0032186933     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1998.0405     Document Type: Article

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