Room temperature grain growth in electroplated copper thin films

Microelectronics Reliability

Volumn 40, Issue 8-10, 2000, Pages 1301-1304

  Wendrock, H ^a   Bruckner W ^a   Hecker, M ^a   Koetter, T G ^a   Schloerb, H ^a  

^a IFW DRESDEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001056978     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00145-1     Document Type: Article

References (6)

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3. Lingk, C., Gross M.E., Brown W.L., Mat. Res. Soc. Symp. Proc., 514, 1999, pp.89-94.
4. Brongersma, S.H., Richard, E., Vervoort, I., Bender, H., Vandervorst, W., Lagrange, S., Beyer, G., Maex, K., J. Appl. Phys. 86 (1999), 7, 3642-3645.
5. Brown A. R., Can. J. Phys. 60, 766 (1982).
6. Brown A. R., J. Phys. F (Metal Phys.) 7 (1977), 1477.