Effect of non-uniform moisture distribution on the hygroscopic swelling coefficient

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 2 SPEC. ISS., 2008, Pages 269-276

  Zhou, Jiang ^a   Law, Japhet S ^b  

^a Lamar University   (United States)

^b CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Finite element analysis (FEA); High accelerated stress tes (HAST)

Indexed keywords

CHARACTERIZATION TECHNIQUES; EXACT ANALYTICAL SOLUTIONS; EXPERIMENTAL DATUM; FAILURE MECHANISMS; FINITE ELEMENT ANALYSIS (FEA); FINITE ELEMENTS; FLIP CHIP BALL GRID ARRAY PACKAGES; HIGH ACCELERATED STRESS TES (HAST); HIGH-ACCELERATED STRESS TESTS; HYGROSCOPIC SWELLINGS; MATERIAL PROPERTIES; MOISTURE ABSORPTIONS; MOISTURE CONTENTS; MOISTURE DIFFUSIONS; MOISTURE DISTRIBUTIONS; NON-UNIFORM; SIMULATION RESULTS; TEMPERATURE CONDITIONS; TEST SPECIMENS; VOLUMETRIC CHANGES;

ABSORPTION; ELECTRONICS PACKAGING; MOISTURE; MOISTURE METERS; SWELLING;

FINITE ELEMENT METHOD;

EID: 45849117686     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.921630     Document Type: Conference Paper

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