Impact of moisture diffusion during solder reflow on package reliability

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 830-836

  Tay, A A O ^a   Lin, T Y ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; INTEGRATED CIRCUIT MANUFACTURE; MOISTURE DETERMINATION; NUMERICAL METHODS; RELIABILITY; SOLDERING; STRAIN RATE; STRESS INTENSITY FACTORS; THERMAL STRESS; THERMODYNAMIC PROPERTIES;

MOISTURE DIFFUSION; SOLDER REFLOW; STRAIN ENERGY RELEASE RATE;

ELECTRONICS PACKAGING;

EID: 0032667355     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (21)