Investigation of Inter-Layer Dielectric (ILD) failure by hygroscopic swelling

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1254-1260

  Zhou, Jiang ^a   Lahoti, Sachin P ^a   Sitlani, Manish P ^a   Kallolimath, Sharan C ^a   Putta, Ramesh ^a  

^a Lamar University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; COMPUTER SIMULATION; DIFFUSION; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; MICROPROCESSOR CHIPS; MOISTURE; RELIABILITY; SILICON; SWELLING;

HYDGROSCOPIC SWELLING; NON-POLYMERIC MATERIALS; SILICON CHIPS; SOLDER BUMP;

DIELECTRIC MATERIALS;

EID: 24644438851     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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8. th Electronic Components and Technology Conference, pp. 830-836, 1999
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