Investigation of non-uniform moisture distribution on determination of hygroscopic swelling coefficient and finite element modeling for a flip chip package

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 112-119

  Zhou, Jiang ^a   Lahoti, Sachin P ^a   Sitlani, Manish P ^a   Kallolimath, Sharan C ^a   Putta, Ramesh ^a  

^a Lamar University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; ATMOSPHERIC HUMIDITY; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; HYGROMETERS; MATHEMATICAL MODELS; SWELLING;

GRID ARRAYS; HYGROSCOPIC SWELLING; MOISTURE ABSORPTION; MOISTURE DIFFUSION;

MOISTURE DETERMINATION;

EID: 33745712177     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502784     Document Type: Conference Paper

References (9)

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