Dynamics of moisture diffusion, hygrothermal stresses and delamination in plasticic packages

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1429-1436

  Lin, T Y ^a   Tay, A A O ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0038088004     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (15)

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3. Hibbitt Karlsson & Sorensen, Inc.,1996, ABAQUS User's Manual, version 5.5, USA
4. th International Reliability Physics Symposium, pp. 90-95
5. Lin, R., Blackshear, E., and Serisky, P., 1988, "Moisture Induced Package Cracking in Plastic Encapsulated Surface Mount Components During Solder Reflow Process," Proc.Intl. Reliability Physics Symp., pp. 83-89
6. Lin, T.Y. and Tay, A. A. O , 1997, "A J-integral Criterion for Delamination of Bi-Material Interfaces Incorporating Hygrothermal Stresses", Interpack'97
7. Liu, S., Zhu, J.S., Hu, J.M., and Pao, Y.H., 1995, " Investigation of Crack Propagation in Ceramic/Conductive Epoxy/Glass System" IEEE Transactions on Components, Packaging, and Manufacturing Technology- PART A, Vol. 18. No.3.
8. Mcmaster, M.G., and Soane, D.S., 1989, "Water Sorption in Epoxy Thin Films," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 12, No.3, pp373-385.
9. Nguyen, L.T., Chen, K.L. and Schaefer, J., 1995, "A New Criterion for Packaging Integrity under Solder Reflow Conditions" 45th ECTC Proceedings, p478
10. Nishimura, A., Hirose, I., and Tanaka, N., 1992, "A New Method for Measuring Adhesion Strength of IC Molding Compounds" Transaction of ASME, J. of Electronic Packaging, vol 114/407
11. Suzuki, S. and Oota, K., 1992, "Analysis of Solder Crack Phenomena in LSI Plastic Packages, " ASME, Advances in Electronic Packaging, Vol.1, pp.343-347
12. Tanaka, N. and Nishimura, A., 1995, "Measurement of IC Molding Compound Adhesion Strength and Prediction of Interface Delamination within Package" EEP-VOL, 10-2. Advance in Electronic Packaging ASME.
13. Tay, A. A. O., Tan, G.L., and Lim, T.B., 1993, "A Criterion for Predicting Delamination in Plastic IC Packages," Proceedings, International Reliability Physics Symposium, pp. 236-243.
14. Tay, A. A. O and Lin, T. Y., 1996, "Moisture Diffusion and Heat Transfer in Plastic IC Packages", IEEE Transactions on Components, Packaging and Manufacturing Technology -Part A, Vol.19. No.2, pp. 186-193.
15. Tay, A. A. O and Lin, T.Y ,1996, " Effects of Moisture and Delamination on Cracking of Plastic IC Packages during Solder Reflow" 46th Electronic Components & Technology Conference, pp. 777-782.