Mechanical properties of sputtered silicon oxynitride films by nanoindentation

Materials Science and Engineering: A

Volumn 489, Issue 1-2, 2008, Pages 294-301

  Liu, Yan ^a   Lin, I Kuan ^a   Zhang, Xin ^a  

^a BOSTON UNIVERSITY   (United States)

Author keywords

Creep; Nanoindentation; Shear transformation zone; Silicon oxynitride; Sputtering; Stress exponent

Indexed keywords

CREEP; CRYSTAL ATOMIC STRUCTURE; ELASTIC MODULI; HARDNESS; NANOINDENTATION; PLASTIC DEFORMATION; PLASTICITY;

ATOMIC BONDING STRUCTURE; SHEAR TRANSFORMATION ZONE; SILICON OXYNITRIDE;

SILICON NITRIDE;

CREEP; CRYSTAL ATOMIC STRUCTURE; ELASTIC MODULI; HARDNESS; NANOINDENTATION; PLASTIC DEFORMATION; PLASTICITY; SILICON NITRIDE;

EID: 44949153469     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2008.01.063     Document Type: Article

References (44)

1. Worhoff K., Driessen A., Lambeck P.V., Hilderink L.T.H., Linders P.W.C., and Popma T.J.A. Sens. Actuators A 74 1 (1999) 9-12
2. Melloni A., Costa R., Monguzzi P., and Martinelli M. Opt. Lett. 28 17 (2003) 1567-1569
3. W.Y. Lien, K. Linliu, M.J. Chemg, U.S. Patent 6022776 (2000).
4. Habermehl S., Nasby R.D., and Rightley M.J. Appl. Phys. Lett. 78 8 (1999) 1122-1124
5. Hattangady S.V., Niimi H., and Lucovsky G. J. Vac. Sci. Technol. A 14 6 (1996) 3017-3023
6. Gusev E.P., Lu H.-C., Garfunkel E.L., Gustafsson T., and Green M.L. IBM J. Res. Dev. 43 3 (1999) 265-286
7. Gunning W.J., Hall R.L., Woodberry F.J., Southwell W.H., and Gluck N.S. Appl. Opt. 28 14 (1989) 2945-2948
8. Brown D.M., Gray P.V., Heumann F.K., Philipp H.R., and Taft E.A. J. Electrochem. Soc. 115 3 (1968) 311
9. Thurn J., Cook R., Kamarajugadda M., Bozeman S.P., and Steams L.C. J. Appl. Phys. 95 3 (2004) 967-976
10. Denisse C.M.M., Troost K.Z., Oude Elferink J.B., Habraken F.H.P.M., and van der Weg W.F. J. Appl. Phys. 60 7 (1986) 2536-2542
11. Habermehl S., Glenzinski A.K., Halliburton W.M., and Sniegowski J.J. Mater. Res. Soc. Symp. Proc. 605 (2000) 49-55
12. Rand M.J., and Roberts J.F. J. Electrochem. Soc. 120 3 (1973) 446-453
13. Denisse C.M.M., Troost K.Z., Habraken F.H.P.M., and van der Weg W.F. J. Appl. Phys. 60 7 (1986) 2543-2547
14. Guimaraes M.S., Sinatora A., Alayo M.I., Pereyra I., and Carreno M.N.P. Thin Solid Films 398/399 (2001) 626-631
15. Criado D., Alayo M.I., Fantini M.C.A., and Pereyra I. J. Non-Cryst. Solids 352 (2006) 2319-2323
16. Jozwik M., Delobelle P., Gorecki C., Sabac A., Nieradko L., Meunier C., and Munnik F. Thin Solid Films 468 1-2 (2004) 84-92
17. Oliver W.C., and Pharr G.M. J. Mater. Res. 7 6 (1992) 1564-1583
18. Oliver W.C., and Pharr G.M. J. Mater. Res. 19 1 (2004) 3-20
19. J.G. Sandland, Sputtered Silicon Oxynitride for Microphotonics: A Materials Study, Ph.D. Thesis, Massachusetts Institute of Technology, Cambridge, U.S., 2005.
20. Du H., Tressler R.E., and Spear K.E. J. Electrochem. Soc. 136 11 (1989) 3210-3215
21. Philipp H.R. J. Non-Cryst. Solids 8-10 (1972) 627-632
22. Sassella A. Phys. Rev. B 48 19 (1993) 14208-14215
23. Gritsenko V.A., Xu J.B., Kwok R.W.M., Ng Y.H., and Wilson I.H. Phys. Rev. Lett. 81 5 (1998) 1054-1057
24. Eriksson T.S., and Granqvist C.G. J. Appl. Phys. 60 6 (1986) 2081-2091
25. Sen P.N., and Thorpe M.F. Phys. Rev. B 15 8 (1977) 4030-4038
26. Galeener F.L. Phys. Rev. B 19 8 (1979) 4292-4297
27. Lucovsky G., Richard P.D., Tsu D.V., Lin S.Y., and Markunas R.J. J. Vac. Sci. Technol. A 4 s (1986) 681-688
28. Tsu D.V., Lucovsky G., and Mantini M.J. Phys. Rev. B 33 10 (1986) 7069-7076
29. Dreer S., and Wilhartitz P. Pure Appl. Chem. 76 6 (2004) 1161-1213
30. Scopel W.L., Fantini M.C.A., Alayo M.I., and Pereyra I. Thin Solid Films 425 1-2 (2003) 275-281
31. Cova P., Poulin S., Grenier O., and Masut R.A. J. Appl. Phys. 97 7 (2005) 073518 1-10
32. Kroll P. J. Non-Cryst. Solids 351 (2005) 1127-1132
33. Vila V., Caceres D., and Prieto C. J. Appl. Phys. 94 12 (2003) 7868-7873
34. Poirier J.P. Creep of Crystals-High Temperature Deformation Processes in Metals, Ceramics and Minerals (1985), Cambridge University Press, Cambridge, UK
35. Bower A.F., Fleck N.A., Needleman A., and Ogbonna N. Proc. R. Soc. Lond. A 441 (1993) 97-124
36. Storakers B., and Larsson P.L. J. Mech. Phys. Solids 42 2 (1994) 307-332
37. Hill R. Proc. R. Soc. Lond. A 436 (1992) 617-630
38. Li H., and Ngan A.H.W. J. Mater. Res. 19 2 (2004) 513-522
39. Spaepen F. Acta. Metall. 25 4 (1977) 407-415
40. Argon A.S. Acta. Metall. 27 1 (1979) 47-58
41. Falk M.L., and Langer J.S. Phys. Rev. E 57 6 (1998) 7192-7205
42. Langer J.S. Phys. Rev. E 64 1 (2001) 011504 1-12
43. Schuh C.A., and Nieh T.G. J. Mater. Res. 19 1 (2004) 46-57
44. Cao Z.Q., and Zhang X. J. Phys. D 39 23 (2006) 5045-5063