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Volumn 14, Issue 6, 1996, Pages 3017-3023
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Integrated processing of silicon oxynitride films by combined plasma and rapid-thermal processing
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Author keywords
[No Author keywords available]
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Indexed keywords
ANNEALING;
AUGER ELECTRON SPECTROSCOPY;
CAPACITORS;
CHARACTERIZATION;
CHEMICAL VAPOR DEPOSITION;
CRYSTAL STRUCTURE;
ELECTRONIC DENSITY OF STATES;
INFRARED SPECTROSCOPY;
NITRIDES;
OXIDATION;
PLASMA APPLICATIONS;
SILICON ALLOYS;
CAPACITANCE VOLTAGE TECHNIQUES;
ELECTRICAL CHARACTERIZATION;
GATE DIELECTRIC THIN FILMS;
MIDGAP INTERFACE STATE DENSITY;
MOS CAPACITORS;
OFFLINE INFRARED SPECTROSCOPY;
ONLINE AUGER ELECTRON SPECTROSCOPY;
PLASMA ASSISTED CHEMICAL VAPOR DEPOSITION;
PLASMA ASSISTED OXIDATION;
SILICON OXYNITRIDE FILMS;
DIELECTRIC FILMS;
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EID: 0030289893
PISSN: 07342101
EISSN: None
Source Type: Journal
DOI: 10.1116/1.580165 Document Type: Article |
Times cited : (78)
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References (18)
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