Optomechanical characterisation of compressively prestressed silicon oxynitride films deposited by plasma-enhanced chemical vapour deposition on silicon membranes

Thin Solid Films

Volumn 468, Issue 1-2, 2004, Pages 84-92

  Jozwik M ^a,b   Delobelle, P ^a   Gorecki, C ^a   Sabac, A ^a   Nieradko, L ^a   Meunier, C ^a   Munnik, F ^c  

^a UNIVERSITÉ DE FRANCHE COMTÉ   (France)

^b WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

^c Ctr d'Analyses par Faisceau Ionique   (Switzerland)

Author keywords

Buckled membrane; Optical properties; PECVD process; Silicon oxynitride; Stress evaluation

Indexed keywords

ELASTIC MODULI; ELECTRONIC DENSITY OF STATES; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; OPTICAL PROPERTIES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; RESIDUAL STRESSES; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SILICON COMPOUNDS; SILICON WAFERS;

BUCKLED MEMBRANES; SILICON MEMBRANES; SILICON OXYNITRIDES; STRESS EVALUATIONS;

THIN FILMS;

EID: 4644294215     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.04.019     Document Type: Article

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