Fabrication of high-density copper microstructures using vacuum ultraviolet light lithography and hydrofluoric acid etching treatment

Thin Solid Films

Volumn 467, Issue 1-2, 2004, Pages 127-132

  Asakura, S ^a   Hozumi, A ^b   Yamaguchi, T ^a   Fuwa, A ^a  

^a WASEDA UNIVERSITY   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Copper; Etching; Self assembled monolayer; Siloxane network

Indexed keywords

ELECTRODEPOSITION; ETCHING; LITHOGRAPHY; MICROSTRUCTURE; MONOLAYERS; ULTRAVIOLET RADIATION;

BIOMOLECULES; SELF-ASSEMBLED MONOLAYER; SILOXANE NETWORK; TEMPLATES;

COPPER;

EID: 4444306314     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.008     Document Type: Article

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