Two- and three-dimensional numerical modeling of copper electroplating for advanced ULSI metallization

Solid-State Electronics

Volumn 44, Issue 5, 2000, Pages 797-807

  Ritter, G ^a   McHugh, P ^a   Wilson, G ^a   Ritzdorf, T ^a  

^a Semitool Incorporated   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROCHEMISTRY; ELECTROPLATING; METALLIZING; NUMERICAL METHODS; SEMICONDUCTOR DEVICE MODELS;

COPPER ELECTROPLATING; ELECTROCHEMICAL DEPOSITION;

ULSI CIRCUITS;

EID: 0033875971     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0038-1101(99)00276-2     Document Type: Article

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