Prospect of lead free alternatives for reflow soldering

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3906, Issue , 1999, Pages 711-721

  Huang, Benlih ^a   Lee, Ning Cheng ^a  

^a INDIUM CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; FLUXES; LEAD; PERFORMANCE; SOLDERED JOINTS; SOLDERING; SURFACE MOUNT TECHNOLOGY; WETTING;

LEAD FREE SOLDER; REFLOW SOLDERING; SHELF LIFE; SOLDER BALLING; TACK TIME;

SOLDERING ALLOYS;

EID: 0033319614     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)