The formation and growth of intermetallic compounds in Sn-Zn and Sn-Zn-ai solder with Ni/Au surface finish bond pad

Journal of Electronic Materials

Volumn 35, Issue 3, 2006, Pages 399-405

  Chang, Shih Chang ^a   Lin, Sheng Chih ^a   Hsieh, Ker Chang ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Au Zn intermetallic compound; Ni Zn intermetallic compound; Reliability; Sn Zn solder; Sn Zn Al solder

Indexed keywords

AGING OF MATERIALS; ALUMINUM COMPOUNDS; BRITTLE FRACTURE; MICROSTRUCTURE; MORPHOLOGY; SHEAR STRENGTH; SOLDERED JOINTS; ZINC COMPOUNDS;

BALL GRID ARRAY; BOND PAD; ELECTRON MICROPROBE ANALYSIS (EPMA); ISOTHERMAL AGING;

INTERMETALLICS;

EID: 33645565828     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02690525     Document Type: Article

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