Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads

Journal of Electronic Materials

Volumn 35, Issue 1, 2006, Pages 147-153

  Liu, Y U Chih ^a   Lin, Wei Hong ^a   Lin, Hsiu Jen ^a   Chuang, Tung Han ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Ag Cu pad; Au Ni Cu pad; Ball shear strength; Intermetallic compounds; Sn 8Zn 20In solder

Indexed keywords

AG/CU PAD; AU/NI/CU PAD; BALL SHEAR STRENGTH; SN-8ZN-20IN SOLDER;

GOLD; INTERMETALLICS; NICKEL; SURFACE TREATMENT; THIN FILMS; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 32644433535     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0197-7     Document Type: Conference Paper

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