Effect of Ag addition on the structures of intermetallic compounds and the adhesion strength of the Sn-9Zn-xAg/Cu interface

Journal of Crystal Growth

Volumn 252, Issue 1-3, 2003, Pages 391-400

  Chang, Tao Chih ^a   Wang, Moo Chin ^b   Hon, Min Hsiung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

A1. Interfaces; A1. Scanning electron microscopy; A1. Transmission electron microscopy; A1. X ray diffraction; B1. Alloys; B1. Intermetallic compounds

Indexed keywords

ADHESION; ELECTRON DIFFRACTION; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); SCANNING ELECTRON MICROSCOPY; SILVER; TIN COMPOUNDS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

ADHESION STRENGTH; LATTICE IMAGES;

INTERMETALLICS;

EID: 0037402014     PISSN: 00220248     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-0248(02)02479-X     Document Type: Article

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