A methodology for the calculation of stress migration in die-level interconnects

Microelectronics Reliability

Volumn 46, Issue 2-4, 2006, Pages 616-625

  Dauksher, W ^a   Marcoux, P ^a   Castleman, G ^a  

^a AGILENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; FINITE ELEMENT METHOD; FLUXES; LARGE SCALE SYSTEMS; THERMAL EFFECTS;

DIE-LEVEL INTERCONNECTS; DIFFUSION MECHANISM; INTEGRATED CIRCUIT DIES; INTERCONNECT STRUCTURES; STRESS MIGRATION;

INTEGRATED CIRCUITS;

EID: 30844472898     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.05.021     Document Type: Article

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