Endurance of lead-free assembly under board level drop test and thermal cycling

Journal of Alloys and Compounds

Volumn 457, Issue 1-2, 2008, Pages 198-203

  Xia, Yanghua ^a   Xie, Xiaoming ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

Author keywords

Drop test; Intermetallic compounds; Lead free; Reliability; Thermal cycling

Indexed keywords

INTERMETALLICS; RELIABILITY THEORY; SOLDERING; THERMAL CYCLING;

DROP TEST; LEAD-FREE;

ELECTRONICS PACKAGING;

EID: 42649098625     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.03.038     Document Type: Article

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