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Volumn 103, Issue 7, 2008, Pages

Structural and electrical characterization of AuPtAlTi Ohmic contacts to AlGaNGaN with varying annealing temperature and Al content

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; ELECTRIC RESISTANCE; MICROSTRUCTURE; THERMAL EFFECTS;

EID: 42149135408     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2890978     Document Type: Article
Times cited : (11)

References (31)
  • 1
    • 42149159895 scopus 로고    scopus 로고
    • Proceedings of the 20th International Conference on Compound Semiconductor Manufacturing Technology, New Orleans, LA, United States of America.
    • M. Rosker, Proceedings of the 20th International Conference on Compound Semiconductor Manufacturing Technology, 2005, New Orleans, LA, United States of America,.
    • (2005)
    • Rosker, M.1
  • 6
    • 42149158148 scopus 로고    scopus 로고
    • in III-V Nitride Semiconductors: Application and Devices, edited by E. T. Yu and M. O. Manasreh (Taylor and Francis, New York)
    • M. W. Cole and P. C. Joshi, in III-V Nitride Semiconductors: Application and Devices, edited by, E. T. Yu, and, M. O. Manasreh, (Taylor and Francis, New York, 2003), pp. 1-66.
    • (2003) , pp. 1-66
    • Cole, M.W.1    Joshi, P.C.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.