Investigation of organic impurities adsorbed on and incorporated into electroplated copper layers

Applied Surface Science

Volumn 252, Issue 1 SPEC. ISS., 2005, Pages 158-161

  Stangl, M ^a   Dittel, V ^a   Acker, J ^a   Hoffmann, V ^a   Gruner, W ^a   Strehle, S ^a   Wetzig, K ^a  

^a IFW DRESDEN   (Germany)

Author keywords

Additives; Copper; Electroplating; GD OES; Self annealing; Surface contamination

Indexed keywords

ANNEALING; CONTAMINATION; ELECTROPLATING; GLOW DISCHARGES; MICROSTRUCTURE; RESIDUAL STRESSES;

ORGANIC ADDITIVES; SELF-ANNEALING; SURFACE CLEANING PROCEDURE; SURFACE CONTAMINATION;

COPPER;

EID: 24644514887     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2005.02.006     Document Type: Conference Paper

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