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Volumn 28, Issue 11, 1999, Pages 1251-1255

Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; EUTECTICS; INTERFACES (MATERIALS); INTERMETALLICS; MORPHOLOGY; NICKEL ALLOYS; SUBSTRATES; TIN ALLOYS; WETTING;

EID: 0033222042     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-999-0164-1     Document Type: Article
Times cited : (81)

References (27)
  • 2
    • 84875815403 scopus 로고
    • S. Jin, JOM 45, 13 (1993).
    • (1993) JOM , vol.45 , pp. 13
    • Jin, S.1
  • 4
    • 84875816761 scopus 로고
    • C. Melton, JOM 45, 33 (1993).
    • (1993) JOM , vol.45 , pp. 33
    • Melton, C.1
  • 27
    • 0342670087 scopus 로고    scopus 로고
    • Doctoral Thesis, University of California at Los Angeles
    • H.K. Kim (Doctoral Thesis, University of California at Los Angeles, 1996).
    • (1996)
    • Kim, H.K.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.