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Volumn 28, Issue 11, 1999, Pages 1251-1255
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Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPOSITION EFFECTS;
EUTECTICS;
INTERFACES (MATERIALS);
INTERMETALLICS;
MORPHOLOGY;
NICKEL ALLOYS;
SUBSTRATES;
TIN ALLOYS;
WETTING;
PHASE IDENTIFICATION;
SOLDERING ALLOYS;
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EID: 0033222042
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-999-0164-1 Document Type: Article |
Times cited : (81)
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References (27)
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