Eutectic Sn/Pb solder bump and under bump metallurgy: Interfacial reactions and adhesion

Soldering and Surface Mount Technology

Volumn 10, Issue 3, 1998, Pages 29-37

  Jang, Se Young ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; DIFFUSION; EUTECTICS; GROWTH (MATERIALS); INTERMETALLICS; LEAD METALLURGY; PHOTORESISTS; SHEAR STRENGTH; SOLDERING; SURFACE CHEMISTRY; TIN METALLURGY; WETTING; ELECTRONICS PACKAGING; LEAD; PRINTED CIRCUIT BOARDS; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; TIN;

SOLDER WETTABILITY; UNDER BUMP METALLURGY (UBM);

FLIP CHIP DEVICES;

EID: 0032182488     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540919810237093     Document Type: Article

References (11)

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