Nanohardness study of CoSn2 intermetallic layers formed between Co UBM and Sn flip-chip solder joints

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 339-342

  Ratchev, P ^a   Labie, R ^a   Beyne, E ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLENESS; COBALT ALLOYS; DIFFUSION; HARDNESS; INDENTATION; INTERMETALLICS;

INTERDIFFUSION REACTIONS; INTERMETALLIC LAYERS;

SOLDERED JOINTS;

EID: 28444479169     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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3. th EPTC, 10-12 December 2003, Singapore, pp. 584-588.
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8. D. Tabor, The Hardness of Metals, Oxford University Press (Oxford. U.K. 1951), pp. 67-83.