The impact of thermal annealing and adhesion film thickness on the resistivity and the agglomeration behavior of titanium/platinum thin films

Journal of Applied Physics

Volumn 103, Issue 5, 2008, Pages

  Schmid, Ulrich ^a  

^a SAARLAND UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AGGLOMERATION; ANNEALING; ELECTRIC CONDUCTIVITY; ELECTRON BEAMS; THIN FILMS;

THERMAL ANNEALING; THERMAL GROOVING EFFECTS;

FILM THICKNESS;

EID: 40849116487     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2838229     Document Type: Article

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