-
1
-
-
33845800317
-
Effect of seed layer stress on the fabrication of monolithic MEMS microstructures
-
Chung, K.; Fang, Y. J.; Cheng, C. M.; Hong, Y. Z.; Wang, C. H. Effect of seed layer stress on the fabrication of monolithic MEMS microstructures. Microsyst. Technol. 2007, 13, 299-304.
-
(2007)
Microsyst. Technol
, vol.13
, pp. 299-304
-
-
Chung, K.1
Fang, Y.J.2
Cheng, C.M.3
Hong, Y.Z.4
Wang, C.H.5
-
2
-
-
34249051408
-
Realization of low-stress Au cantilever beams
-
Stanec, J. R.; Smith III, C. H.; Chasiotis, I.; Barker, N. S. Realization of low-stress Au cantilever beams. J. Micromech. Microeng. 2007, 17, N7-N10.
-
(2007)
J. Micromech. Microeng
, vol.17
-
-
Stanec, J.R.1
Smith III, C.H.2
Chasiotis, I.3
Barker, N.S.4
-
3
-
-
0031220965
-
Comparison of stress measurement techniques in surface micromaching
-
Elbrecht, L.; Storm, U.; Catanescu, R.; Binder, J. Comparison of stress measurement techniques in surface micromaching. J. Micromech. Microeng. 1997, 7, 151-154
-
(1997)
J. Micromech. Microeng
, vol.7
, pp. 151-154
-
-
Elbrecht, L.1
Storm, U.2
Catanescu, R.3
Binder, J.4
-
4
-
-
0028508282
-
Post buckling of micromaching beams
-
Fang, W.; Wickert, J. A. Post buckling of micromaching beams. J. Micromech. Microeng. 1994, 4, 116-122.
-
(1994)
J. Micromech. Microeng
, vol.4
, pp. 116-122
-
-
Fang, W.1
Wickert, J.A.2
-
5
-
-
0030230992
-
Determining mean and gradient residual stresses in thin films using micromachined cantilevers
-
Fang, W.; Wickert, J.A. Determining mean and gradient residual stresses in thin films using micromachined cantilevers. J. Micromech. Microeng. 1996, 6, 301-309.
-
(1996)
J. Micromech. Microeng
, vol.6
, pp. 301-309
-
-
Fang, W.1
Wickert, J.A.2
-
6
-
-
10044223567
-
Selection of mold materials for electroforming of monolithic two-layer microstructure
-
Chung, C.K.; Lin, C.J.; Wu, L.H.; Fang, Y.J.; Hong, Y.Z. Selection of mold materials for electroforming of monolithic two-layer microstructure. Microsyst. Technol. 2004, 10, 467-471.
-
(2004)
Microsyst. Technol
, vol.10
, pp. 467-471
-
-
Chung, C.K.1
Lin, C.J.2
Wu, L.H.3
Fang, Y.J.4
Hong, Y.Z.5
-
7
-
-
0037285274
-
A study on the fabrication of multi-layer microstructure using ELID grinding and the thick photoresist technology
-
Kim, J.W.; Yamagata, Y.; Monta, S.; Moriyasu, S.; Ohmori, H.; Higuchi, T. A study on the fabrication of multi-layer microstructure using ELID grinding and the thick photoresist technology. Key Eng. Mater. 2003, 238-239, 19-22.
-
(2003)
Key Eng. Mater
, vol.238-239
, pp. 19-22
-
-
Kim, J.W.1
Yamagata, Y.2
Monta, S.3
Moriyasu, S.4
Ohmori, H.5
Higuchi, T.6
-
8
-
-
0242580109
-
Electromechanical model of RF MEMS switches
-
Zhang, L.X. and Zhao, Y.P. Electromechanical model of RF MEMS switches. Microsyst. Technol. 2003, 9, 420-426.
-
(2003)
Microsyst. Technol
, vol.9
, pp. 420-426
-
-
Zhang, L.X.1
Zhao, Y.P.2
-
9
-
-
0033341836
-
Energy study of buckled micromachined beams for thin-film stress measurements applied to SiO2
-
Nicu, L.; Temple-Boyer, P.; Bergaud, C.; Scheid, E.; and Martinez, A. Energy study of buckled micromachined beams for thin-film stress measurements applied to SiO2. J. Micromech. Microeng. 1999, 9, 414-421
-
(1999)
J. Micromech. Microeng
, vol.9
, pp. 414-421
-
-
Nicu, L.1
Temple-Boyer, P.2
Bergaud, C.3
Scheid, E.4
Martinez, A.5
-
10
-
-
4544221593
-
Thin films stress extraction using micromachined structures and wafer curvature measurements
-
Laconte, J.; Iker, F.; Jorez S.; Andre, N.; Proost, J.; Pardoen, T.; Flandre, D.; Raskin, J.P. Thin films stress extraction using micromachined structures and wafer curvature measurements. Microelectron. Eng. 2004, 76, 219-226.
-
(2004)
Microelectron. Eng
, vol.76
, pp. 219-226
-
-
Laconte, J.1
Iker, F.2
Jorez, S.3
Andre, N.4
Proost, J.5
Pardoen, T.6
Flandre, D.7
Raskin, J.P.8
-
11
-
-
9644278154
-
Measurement of the mechanical properties of electroplated gold thin films using micromachined beam structures
-
Baek, C.W.; Kim, Y.K.; Ahn, Y.; Kim, Y.H. Measurement of the mechanical properties of electroplated gold thin films using micromachined beam structures. Sens. Actual A 2005, 117, 17-27.
-
(2005)
Sens. Actual A
, vol.117
, pp. 17-27
-
-
Baek, C.W.1
Kim, Y.K.2
Ahn, Y.3
Kim, Y.H.4
-
12
-
-
0242671766
-
Frequency-shifting analysis of electrostatic tunable micromechanical actuator
-
Lee, W. S.; Kwon, K. C.; Kim, B. K.; Cho, J. H. Youn, S. K. Frequency-shifting analysis of electrostatic tunable micromechanical actuator. J. Model. Simul. Microsyst. 2001, 2, 83-88.
-
(2001)
J. Model. Simul. Microsyst
, vol.2
, pp. 83-88
-
-
Lee, W.S.1
Kwon, K.C.2
Kim, B.K.3
Cho, J.H.4
Youn, S.K.5
-
13
-
-
3142683157
-
Modelling and prediction of the dynamic behaviour of microbeams under electrostatic load
-
Brusa, E.; De Bona, F.; Gugliotta A.; Soma, A. Modelling and prediction of the dynamic behaviour of microbeams under electrostatic load. Analog Integr. Cire S. 2004, 40, 155-164.
-
(2004)
Analog Integr. Cire S
, vol.40
, pp. 155-164
-
-
Brusa, E.1
De Bona, F.2
Gugliotta, A.3
Soma, A.4
-
14
-
-
22144463874
-
Dynamic Identification of MEMS by Eigensensitivity and Newmark Simulation
-
Van Der Poel Filho, C. J. ; Gugliotta, A.; Soma A.; Pavanello, R. Dynamic Identification of MEMS by Eigensensitivity and Newmark Simulation. Analog Integr. Circ. S. 2005, 44, 155-162.
-
(2005)
Analog Integr. Circ. S
, vol.44
, pp. 155-162
-
-
Van Der Poel Filho, C.J.1
Gugliotta, A.2
Soma, A.3
Pavanello, R.4
-
15
-
-
40849123556
-
Model synthesis of structural dynamics for electrostatic microactuators
-
Presented at, Paris, 20-21 October
-
Brusa, E.; De Bona, F.; Della Schiava, A.; Soma, A. Model synthesis of structural dynamics for electrostatic microactuators. Presented at European micro and nano systems 2004, Paris, 20-21 October, 2004.
-
(2004)
European micro and nano systems
-
-
Brusa, E.1
De Bona, F.2
Della Schiava, A.3
Soma, A.4
-
16
-
-
33644521739
-
An effective method of determining the residual stress gradients in a micro-cantilever
-
Zhang, Y.; Zhao, Y. An effective method of determining the residual stress gradients in a micro-cantilever. Microsyst. Technol. 2006, 12, 357-364.
-
(2006)
Microsyst. Technol
, vol.12
, pp. 357-364
-
-
Zhang, Y.1
Zhao, Y.2
-
17
-
-
33750613043
-
Stress and resistivity analysis of electrodeposited gold films for MEMS application
-
Subhadeep, K.; Bagolini, A.; Margesin, B.; Zen, M. Stress and resistivity analysis of electrodeposited gold films for MEMS application. Microelectron. J. 2006, 37.
-
(2006)
Microelectron. J
, pp. 37
-
-
Subhadeep, K.1
Bagolini, A.2
Margesin, B.3
Zen, M.4
-
18
-
-
84945921052
-
-
France, 5-7 May
-
Margesin, B.; Bagolini, A.; Guamieri, I.; Giacomozzi, F.; Faes, A. Stress characterization of electroplated gold layers for low temperature surface micromachining. Presented at Symposium on Design Test, Integration & Packaging of MEMS-MOEMS; Mandelieu-La Napoule, France, 5-7 May, 2003.
-
(2003)
Stress characterization of electroplated gold layers for low temperature surface micromachining. Presented at Symposium on Design Test, Integration & Packaging of MEMS-MOEMS; Mandelieu-La Napoule
-
-
Margesin, B.1
Bagolini, A.2
Guamieri, I.3
Giacomozzi, F.4
Faes, A.5
-
20
-
-
40849105964
-
Experimental characterization of the static behaviour of microcantilevers electrostatically actuated
-
Presented at, Stresa, Italy, 25-27 April
-
Ballestra, A.; Brusa, E.; Munteanu, M.G.; Soma, A. Experimental characterization of the static behaviour of microcantilevers electrostatically actuated. Presented at Symposium on Design Test, Integration & Packaging of MEMS-MOEMS; Stresa, Italy, 25-27 April 2007.
-
(2007)
Symposium on Design Test, Integration & Packaging of MEMS-MOEMS
-
-
Ballestra, A.1
Brusa, E.2
Munteanu, M.G.3
Soma, A.4
-
21
-
-
1642603469
-
Large deflections of microbeams under electrostatic loads
-
Collenz, A.; De Bona, F.; Gugliotta A.; Soma, A. Large deflections of microbeams under electrostatic loads. J. Micromech. Microeng. 2004, 14, 365-37.
-
(2004)
J. Micromech. Microeng
, vol.14
, pp. 365-437
-
-
Collenz, A.1
De Bona, F.2
Gugliotta, A.3
Soma, A.4
-
22
-
-
0035423968
-
3D measurement of micromechanical devices vibration mode shapes with a stroboscopic interferometric microscope
-
Petitgrand, S.; Yahiaoui, R.; Danaie, K.; Bosseboeuf, A.; Gilles, J. P. 3D measurement of micromechanical devices vibration mode shapes with a stroboscopic interferometric microscope. Optics and Lasers in Engineering 2001, 36(2), 77-101.
-
(2001)
Optics and Lasers in Engineering
, vol.36
, Issue.2
, pp. 77-101
-
-
Petitgrand, S.1
Yahiaoui, R.2
Danaie, K.3
Bosseboeuf, A.4
Gilles, J.P.5
-
23
-
-
0030230992
-
Determining mean and gradient residual stresses in thin films using micromachined cantilevers
-
Fang, W.; Wickert, J. A. Determining mean and gradient residual stresses in thin films using micromachined cantilevers. J. Micromech. Microeng. 1996, 6.
-
(1996)
J. Micromech. Microeng
, vol.6
-
-
Fang, W.1
Wickert, J.A.2
-
24
-
-
40849107521
-
-
IEEE
-
Tibeica, C.; Voicu, R.; Bazu, M.; Ilian, V.E.; Vasilache, D.; Galateanu, L.; Pons, P.; Yacine, K.; Flourens, F. Analytical VS. Computational approach of the pull-in voltage of electrostatically actuated micro-bridges, 0-7803-9214-0/05 IEEE 2005.
-
(2005)
Computational approach of the pull-in voltage of electrostatically actuated micro-bridges, 0-7803-9214-0/05
-
-
Tibeica, C.1
Voicu, R.2
Bazu, M.3
Ilian, V.E.4
Vasilache, D.5
Galateanu, L.6
Pons, P.7
Yacine, K.8
Flourens, F.9
Analytical, V.S.10
-
25
-
-
0038824585
-
Analysis of electromechanical boundary effects on the pull-in of micromachined fixed-fixed beams
-
O'Mahony, C.; Hill, M.; Duane, R.; Mathewson, A.; Analysis of electromechanical boundary effects on the pull-in of micromachined fixed-fixed beams. J. Micromech. Microeng. 2003, 13, S75-S80.
-
(2003)
J. Micromech. Microeng
, vol.13
-
-
O'Mahony, C.1
Hill, M.2
Duane, R.3
Mathewson, A.4
-
26
-
-
40849129737
-
-
Stresa, Italy, 25-27 April
-
Soma, A.; De Pasquale, G. Identification of test structures for Reduced Order Modeling of the squeeze film damping in MEMS. Presented at Symposium on design, test, integration and packaging of mems/moems, 2007, Stresa, Italy, 25-27 April, 2007.
-
(2007)
Identification of test structures for Reduced Order Modeling of the squeeze film damping in MEMS. Presented at Symposium on design, test, integration and packaging of mems/moems
-
-
Soma, A.1
De Pasquale, G.2
-
27
-
-
84876646471
-
-
ANSYS 10.0 User Manual and references vs. 10.0.
-
ANSYS 10.0 User Manual and references vs. 10.0.
-
-
-
-
28
-
-
0031168990
-
M-Test: A test chip for MEMS material property measurement using electrostatically actuated test structures
-
Osterberg, P.M.; Senturia, S.D. M-Test: a test chip for MEMS material property measurement using electrostatically actuated test structures. J. Microelectromech. Syst. 1997, 6(2).
-
(1997)
J. Microelectromech. Syst
, vol.6
, Issue.2
-
-
Osterberg, P.M.1
Senturia, S.D.2
-
30
-
-
0035605863
-
A methodology and model for the pull-in parameters of electrostatic actuators
-
Nemirovsky, Y.; Bochobza-Degani, O. A methodology and model for the pull-in parameters of electrostatic actuators. J. Microelectromech. Syst. 2001, 10(4).
-
(2001)
J. Microelectromech. Syst
, vol.10
, Issue.4
-
-
Nemirovsky, Y.1
Bochobza-Degani, O.2
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