Effect of seed layer stress on the fabrication of monolithic MEMS microstructure

Microsystem Technologies

Volumn 13, Issue 3-4, 2007, Pages 299-304

  Chung, C K ^a   Fang, Y J ^b   Cheng, C M ^c   Hong, Y Z ^a   Wang, C H ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; ELECTROFORMING; LITHOGRAPHY; MICROELECTROMECHANICAL DEVICES; RESIDUAL STRESSES;

INTEGRATED TECHNOLOGY; MONOLITHIC MICROSTRUCTURE; SEED LAYER STRESS;

MICROSTRUCTURE;

EID: 33845800317     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0179-y     Document Type: Article

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