A study on the fabrication of multi-layer microstructures using ELID grinding and the thick photoresist lithography technology

Key Engineering Materials

Volumn 238-239, Issue , 2003, Pages 19-22

  Kim, J W ^a,b   Yamagata, Y ^a   Morita, S ^a,b   Moriyasu, S ^a   Ohmori, H ^a   Higuchi, T ^b  

^a INST OF PHYS AND CHEMICAL RESEARCH   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

Author keywords

Complex micro structure; Electroplating; ELID grinding; MEMS; SU 8; Thick photoresist lithography

Indexed keywords

ELECTROPLATING; LITHOGRAPHY; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; MULTILAYERS; NICKEL; PHOTORESISTS; THREE DIMENSIONAL;

COMPLEX MICROSTRUCTURE; ELECTROLYTIC IN PROCESS DRESSING; MULTILAYER MICROSTRUCTURES; NICKEL STRUCTURE; THICK PHOTORESIST LITHOGRAPHY;

GRINDING (MACHINING);

EID: 0037285274     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/kem.238-239.19     Document Type: Article

References (2)

1. J.W. Kim et al., Advances in Abrasive technology IV (2000) p. 115-118.
2. Yamagata, Y et al. Proc. of EUSPEN, Bremen, (1999) p.132-134.