Stress and resistivity analysis of electrodeposited gold films for MEMS application

Microelectronics Journal

Volumn 37, Issue 11, 2006, Pages 1329-1334

  Kal, Subhadeep ^a   Bagolini, A ^b   Margesin, B ^b   Zen, M ^b  

^a INDIAN INSTITUTE OF TECHNOLOGY   (India)

^b ITC IRST   (Italy)

Author keywords

Gold films; Grain growth; Thin films

Indexed keywords

ELECTRIC CONDUCTIVITY; ELECTRODEPOSITION; ELECTROPLATING; GOLD; MICROELECTROMECHANICAL DEVICES; PARAMETER ESTIMATION; STRESS ANALYSIS;

DEPOSITION PARAMETERS; ELECTROPLATED GOLD FILMS; LOW PROCESSING TEMPERATURE; MICROSYSTEMS;

THIN FILMS;

EID: 33750613043     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2006.07.006     Document Type: Article

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